CMI1650 pages

CMI165 ®

165

Copper thickness measurement with temperature compensation

Oxford Instruments CMI165 provides unique
temperature compensated Copper thickness
measurements in an ergonomic
hand-held device
Measurements on Copper are affected
by the temperature of the sample. The
CMI165 accounts for temperature in
the measurement of thickness
ensuring accurate
in-process inspection
results regardless
of Copper
temperature. This
versatile, portable
gauge equipped with
protective case, has a rugged
and durable design that allows it to
be taken into the harshest environments.

• Measure hot or cold Cu on PCBs
•t Reduce waste by eliminating the need for coupons
•t Measure foil or laminated Cu thickness in µm, mils or oz
•t Sort Cu by weight at incoming inspection, before
drilling, shearing or plating

•t Quantify Cu thickness after etching or planarizing
•t Verify Cu plating thickness on PCB surfaces