CMI 5630 pages

CMI563 ®
For surface copper measurement

Oxford Instruments’ CMI563
product was designed
specifically for copper foil
on rigid, flexible, single
and double-sided,
or multi-layer PCB boards
The CMI563 employs the micro resistance test method
technology, providing the most effective and efficient way of
achieving accurate, precise measurement of surface copper
thickness, including copper-clad laminate, electroless, and
electrolytic copper. Featuring the market’s most advanced test
technology, copper plating on the opposing side of the printed
circuit board will not interfere with precise, reliable readings,
regardless of laminate thickness.
The innovative CMI563 gauge includes the SRP-4 Probe
engineered with user replaceable probe tips. These tip
replacements are more convenient and less expensive as
compared to probe replacement. The CMI563 is user selectable
for electroless and electrodeposited copper types, and even
fine line trace measurements, no user calibration required.
NIST-traceable check standards are available in a variety of
thicknesses. This quality instrument is backed by warranty and
Oxford Instruments’ world-class customer service.

SRP-4 Probe
The tethered SRP-4 probe features a rugged, reliable cable for
field applications. Additionally, the SRP-4’s small footprint is
convenient and user-friendly.

563