Katiobond 45520 pages

Technical Data Sheet

Katiobond 4552

Base: - Modified epoxy resin, one-part, solvent-free, light activated Curing: - Activation with visible light in the wavelength range of 400 to 550 nm - Cationic mechanism allows curing even in shadow zones with sufficient illumination - Further curing until final strength at room temperature - Heating accelerates, lower temperatures delay reaction Curing parameter: - Depending on thickness and absorption of material involved, thickness of adhesive layer, type of lamp and distance of lamp from adhesive layer Use: - Used for bonding metals, glass, plastics, and other materials as well as for coating, securing or sealing electronic components - Especially for coating boards, sealing relays and switches as well as for bonding stacks of contact Application: Technical data Color - Supplied ready to use and best applied from the original container or with Cyberbond recommended dispensing units - Surfaces to be bonded should be dry, free of dust, grease, and other contaminants >
Cured in layer thickness of approx. 0,1 mm Brown Density [g/cm] 1.1 >
at room temperature Viscosity [mPas] 1200 >
at 23ӰC Brookfield sp/rot 3/10 Final strength [h] 24 >
at RT Shear strength >
joint part material glass/glass [MPa] 24 >
joint part material PC/PC [Mpa] 30 >
joint part material PETP/PETP [MPa] 3 >
Intensity: 45 - 50mW/cm Illumination time: 60s Curing time: 24h at room temperature Tensile strength [MPa] 14 >
DIN 53504 Page 1 of 2 size="-1">