Dualbond 7070 pages

Technical Data Sheet

DualBond 707

Base: - Modified epoxy resin, one-part, solvent-free, light/heat curing Curing: - Activation with visible light in the wavelength range of 400 to 550 nm - In shadow areas product can be cured by heat - Light curing mechanism and heat curing mechanism can be used independently Curing parameter: - Heat-up time of joining parts must be added to curing time - Heat-up time should not exceed 15 min - Depending on thickness and absorption of material involved, thickness of adhesive layer, type of lamp and distance of lamp from adhesive layer - For heat curing in shadow zones preferably a temperature of +130C and a curing time of 3 min can be used - Minimal curing temperature is 120аC with a cure time of 6 min Use: - Used for bonding metals, glass, plastics, and other materials as well as for coating, securing or sealing electronic components - Especially for stress equalizing bondings and sealings, in particular if the bonded part is exposed to high variation in temperature Application: - Supplied ready to use and best applied from the original container or with Cyberbond recommended dispensing units - Surfaces to be bonded should be dry, free of dust, grease, and other contaminants Technical data Color Yellow >
Cured in layer thickness of approx. 0,1 mm Density [g/cm] 1.1 >
at room temperature Viscosity [mPas] 1600 >
at 23ӰC Brookfield sp/rot 3/10 Final strength [h] 24 >
at RT Page 1 of 2 size="-1">