NPM0 pages

Placement head

16-nozzle head (With Dual Heads)

12-nozzle head (With Dual Heads)

8-nozzle head (With Dual Heads)

2-nozzle head (With Dual Heads)

Placement speed Max. speed

70 OOOcph (0.051 s/chip)

62 500cph (0.058 s/chip)

40 OOOcph(0.090 s/chip)

8 500cph (0.423 s/QFP)

IPC9850(1608)

53 800cph-E

48 OOOcph-5

Placement accuracy(Cpkfel)

±40 A/m/chip

±40 ym/chip

±40 um/ chip

±30i/m/QFP □12mm ~ 03211111

±50ym/QFP m 2 mm Under

±30 ym/QFP

Component dimensions (mm)

(01005")0402chip«e toL6xW6xT3

(01005") 0402 ch ip -e to L12 X W12 X T 6.5

(01005") 0402 chip-e to L 32 X W 32 X T12

(0201")0603 chip to L 100 X W 90 X T 28

Component

supply

Taping

Tape : 8 / 12 / 1 6 / 24 / 32 / 44 / 56 mm

Tape:8 to56/72/88/ 104mm

8 mm tape : Max. 68 (double feeder, small real)

Stick.Tray

Stick: Max. 8, Tray: Max. 20 (per tray feeder)

Dispensing head

Dot dispensing

Draw dispensing

Dispensing speed

0.16 s/dot (Condition :XY= 10 mm, Z=less than 4 mm movement, No S rotation)

3.75 s/component (Condition: 30 mm x 30 mm corner dispensing)

Adhesive position accuracytCpte 1)

± 75 um/tiot

± 100 A/m/component

Applicable components

1608 chip to SOP.PLCC.QFP.Connector.BGA.CSP

SOP.PLCC.QFP.Connector.BGA.CSP

Inspection head

2D inspection head (A)

2D inspection head(B)

Resolution

18 um

9 um

View size

44.4 mm x 37.2 mm

21.1 mm x 17.6 mm

inspection Solder Inspection's

0.35s/ View size

Miuuubblllg

time

Component Inspection -a

0.5s/ View size

Inspection

object

Solder

Inspection's

Chip component: 100 u m x 150 u m or more (0603 / 0201" or more)

Package component: $ 150 /um or more

Chip component: 80 um x 120 um or more (0402 / 01005" or more)

Package component: $ 120 um or more

Component

Inspection's

Square chip (0603 / 0201' or more), SOP, QFP (a pitch of 0.4mm or more),

CSP, BGA.AIuminum electrolysis capacitor, Volume, Trimmer. Coil, Connector,

Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf

Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more),

CSP. BGA.AIuminum electrolysis capacitor, Volume. Trimmer, Coil. Connector,

Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf

Inspection

items

Solder Inspection's

Oozing, blur, misalignment, abnormal shape, bridging

Component Inspection's

Missing, shift, flipping, polarity, foreign object inspections

Inspection position accuracy (Cpte 1) -a

± 20 yum I ± 10 jum

No. of

inspection

Solder Inspection's

Component Inspection's

Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)

Max. 10 000 pcs./machine

/^Safety Cautions

• Please read the User's Manual carefully to

familiarize yourself with safe and effective

usage procedures.

• To ensure safety when using this equipment all work should be

performed according to that as stated in the supplied Operating

Instructions. Read your operating instruction manual thoroughly.

^yfl^ Panasonic Group products are

ftrpjfff built with the environment in mind.

|JiliP' http://panasonic.net/eco/

Panasonic Group builds Environmental Management System in the

prrfl factories of the world and acquires the International Environmental

Uiiy Standard ISO 14001:2004.