NPM0 pages
Model ID
nnnnNPM-D
nnnnFront head
nnnnRear head
nnnn16-nozzle head 12-nozzle head 8-nozzle head 2-nozzle head Dispensing head No head
nnnn16-nozzle head
nnnn12-nozzle head
nnnn8-nozzle head
nnnn2-nozzle head
nnnnDispensing head
nnnnNM-EJM1D
nnnnNM-EJM1D-MD
nnnnNM-EJM1D-MD NM-EJM1D
nnnnNM-EJM1D-D
nnnnInspection head
nnnn_ No head
nnnnPCB Dual-lane mode
nnnndimensions*! Single-lane mode
nnnnL 50 mm x W 501
nnnnL 50 mm x W 50 [
nnnn_NM-EJM1D-MA
nnnnNM-EJM1D
nnnnL 510 mm x W 300 mm
nnnnL 510 mm x W 590 mm
nnnnPCB
nnnnexchange
nnnntime
nnnn_ NM-EJM1D-A
nnnnNM-EJM1D-D | -
nnnnDual-lane mode Q s* *No 0s when cycle time is 4.5 s or less
nnnnSingle-lane mode 4.5s
nnnnElectric source
nnnn3-phase AC 200. 220. 380. 400. 420. 480 V 2.5 kVA
nnnnPneumatic source's
nnnnDimensions *2
nnnn0.5 MPa, 1 00 L /min (A.N.R.)
nnnnW 835 mmx D 2 652 mm«3 x H 1 444
nnnnMass
nnnn1 520 kg (Only for main body:This differs depending on the option configuration.)
nnnnPlacement head | 16-nozzle head (With Dual Heads) | 12-nozzle head (With Dual Heads) | 8-nozzle head (With Dual Heads) | 2-nozzle head (With Dual Heads) | |
Placement speed Max. speed | 70 OOOcph (0.051 s/chip) | 62 500cph (0.058 s/chip) | 40 OOOcph(0.090 s/chip) | 8 500cph (0.423 s/QFP) | |
IPC9850(1608) | 53 800cph-E | 48 OOOcph-5 | |||
Placement accuracy(Cpkfel) | ±40 A/m/chip | ±40 ym/chip | ±40 um/ chip ±30i/m/QFP □12mm ~ 03211111 ±50ym/QFP m 2 mm Under | ±30 ym/QFP | |
Component dimensions (mm) | (01005")0402chip«e toL6xW6xT3 | (01005") 0402 ch ip -e to L12 X W12 X T 6.5 | (01005") 0402 chip-e to L 32 X W 32 X T12 | (0201")0603 chip to L 100 X W 90 X T 28 | |
Component supply | Taping | Tape : 8 / 12 / 1 6 / 24 / 32 / 44 / 56 mm | Tape:8 to56/72/88/ 104mm | ||
8 mm tape : Max. 68 (double feeder, small real) | |||||
Stick.Tray | Stick: Max. 8, Tray: Max. 20 (per tray feeder) |
Dispensing head | Dot dispensing | Draw dispensing |
Dispensing speed | 0.16 s/dot (Condition :XY= 10 mm, Z=less than 4 mm movement, No S rotation) | 3.75 s/component (Condition: 30 mm x 30 mm corner dispensing) |
Adhesive position accuracytCpte 1) | ± 75 um/tiot | ± 100 A/m/component |
Applicable components | 1608 chip to SOP.PLCC.QFP.Connector.BGA.CSP | SOP.PLCC.QFP.Connector.BGA.CSP |
Inspection head | 2D inspection head (A) | 2D inspection head(B) | |
Resolution | 18 um | 9 um | |
View size | 44.4 mm x 37.2 mm | 21.1 mm x 17.6 mm | |
inspection Solder Inspection's | 0.35s/ View size | ||
Miuuubblllg time | Component Inspection -a | 0.5s/ View size | |
Inspection object | Solder Inspection's | Chip component: 100 u m x 150 u m or more (0603 / 0201" or more) Package component: $ 150 /um or more | Chip component: 80 um x 120 um or more (0402 / 01005" or more) Package component: $ 120 um or more |
Component Inspection's | Square chip (0603 / 0201' or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA.AIuminum electrolysis capacitor, Volume, Trimmer. Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf | Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP. BGA.AIuminum electrolysis capacitor, Volume. Trimmer, Coil. Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf | |
Inspection items | Solder Inspection's | Oozing, blur, misalignment, abnormal shape, bridging | |
Component Inspection's | Missing, shift, flipping, polarity, foreign object inspections | ||
Inspection position accuracy (Cpte 1) -a | ± 20 yum I ± 10 jum | ||
No. of inspection | Solder Inspection's Component Inspection's | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | |
Max. 10 000 pcs./machine |
* Placement tact time,inspection time and accuracy values may
nnnndiffer slightly depending on conditions
nnnn*Please refer to the specification booklet for details,
nnnn*1 : As board transfer standard differ, it cannot be linked with dual-lane spec.
nnnnMPM (NM-EJM9B).
nnnn*2 : Only for main body
nnnn*3 : Dimension D including tray feeder: 2 683 mm
nnnnDimension □ including feeder cart: 2 728 mm
nnnn*4 : Excluding monitor and signal tower
nnnn*5 : It is the reference value of the tact time by the IPC9850 conformity.
nnnn*6 : The 0402 chip requires a specific nozzle/feeder.
nnnn*7 : Foreign body inspection is available to chip components
nnnn*8 : One head cannot handle solder inspection and
nnnncomponent inspection at the same time.
nnnn*9 : This is the solder inspection position accuracy
nnnnmeasured by our reference using our glass PCB for
nnnnplane calibration. It may be affected by sudden
nnnnchange of ambient temperature.
nnnn/^Safety Cautions | |
• Please read the User's Manual carefully to familiarize yourself with safe and effective usage procedures. | • To ensure safety when using this equipment all work should be performed according to that as stated in the supplied Operating Instructions. Read your operating instruction manual thoroughly. |
^yfl^ Panasonic Group products are ftrpjfff built with the environment in mind. |JiliP' http://panasonic.net/eco/ | Panasonic Group builds Environmental Management System in the prrfl factories of the world and acquires the International Environmental Uiiy Standard ISO 14001:2004. |
inquiries-
nnnnPanasonic Factory Solutions Co., Ltd.
nnnnCorporate Sales Division
nnnn1375 Kamisukiawara, Showa-cho, Nakakoma-gun, Yamanashi 409-3895, Japan
nnnnTEL+81-55-275-9148
nnnnFAX +81-55-275-6269
nnnnAll data as of December 1, 2011
nnnnVer.December 1,2011
nnnn©Panasonic Factory Solutions Co.,Ltd.2011
nnnn►Changes in specifications and appearance may be made without notice for product improvement.
nnnn»HomePage http://panasonic.net/pfsc/
nnnn►Recycled paper is used this Catalog.
nnnnPanasonic
nnnnideas for life
nnnn2012
nnnnElectronics Assembly System f
nnnncatalog .
nnnnPRODUCTION MODULAR
nnnnNEXT PRODUCTION MODULAR
nnnnManufacturing Process Innovation
nnnnModel Name
nnnnNPM-D
nnnnModel No.NM-EJMW
nnnnModel No.NM—EJM1D—MD Model No.NM-EJM1D-D
nnnnModel No.NM—EJM 1D—MA Model No.NM-EJM1D-A
nnnnLNB conveyor + 3 production modulars in-line setup
nnnnC€
nnnn*lt may not conform to Machinery Directive
nnnnand EMC Directive in case of optional
nnnnconfiguration and custom-made specification.
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