MD-P2000 pages
Panasonic
nnnnideas for life
nnnn2010
nnnnIC Assembly System
nnnncatalog
nnnnDEVICE BONDER
nnnnHigh quality bonding (High Accuracy, Epoxy Quality etc.) contributes to valuable
nnnndevices production.
nnnnMulti small die capability contributes to downsizing of valuable devices.
nnnnVariety of Epoxy-supplying method (Writing , Stamping , Dual Epoxy etc.)
nnnncontributes to flexible production.
nnnnModel ID | MDP200 |
Model No. | NM-EFD1B |
Productivity*1 | 0.56 s/die (under the fastest condition) |
Placement accuracy*1 | XY: ±15 um, 8 : ±0.3° (3a at PFSC condition) |
Substrate Dimensions | L 50 mm x W 30 mm to L 200 mm x W140 mm |
(Option: L loader / unloader maximum of 280 mm, Size can be changed.) | |
Die Dimensions | L0.25mmxW0.25mmtoL6mmxW6mm |
Number of Die types | 5 types (wafer supply), 10 type (tray supply) |
Configuration of die feeder | Flat rings, pre-expanding rings or trays (fed to a dedicated pallet) |
Number of nozzles | Maximum 24 nozzles (Pick-up nozzle, Bonding nozzle, stamping tool) |
Power Source*2 | 3-phase AC 200 V ±10 V, 50Hz/60Hz, 4 kVA |
Pneumatic Source | 0.5 MPa, 30 L/min (A.N.R.) |
Dimensions | W1 950 mm x D1190 mm x H1 720 mm (including loader / unloader) |
(Machine body: W1190 mm x D1190 mm x H1 720 mm) | |
Mass | 2 200 kg (including loader / unloader) |
*1 *1 The above described productivity and bonding accuracy may differ depending on the condions of use.
nnnn•2 Three-phase 208 / 220 / 380 / 400 / 415 / 480
nnnn* For details, refer to the specification manual.
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