MD-P2000 pages

Model ID

MDP200

Model No.

NM-EFD1B

Productivity*1

0.56 s/die (under the fastest condition)

Placement accuracy*1

XY: ±15 um, 8 : ±0.3° (3a at PFSC condition)

Substrate Dimensions

L 50 mm x W 30 mm to L 200 mm x W140 mm

(Option: L loader / unloader maximum of 280 mm, Size can be changed.)

Die Dimensions

L0.25mmxW0.25mmtoL6mmxW6mm

Number of Die types

5 types (wafer supply), 10 type (tray supply)

Configuration of die feeder

Flat rings, pre-expanding rings or trays (fed to a dedicated pallet)

Number of nozzles

Maximum 24 nozzles (Pick-up nozzle, Bonding nozzle, stamping tool)

Power Source*2

3-phase AC 200 V ±10 V, 50Hz/60Hz, 4 kVA

Pneumatic Source

0.5 MPa, 30 L/min (A.N.R.)

Dimensions

W1 950 mm x D1190 mm x H1 720 mm (including loader / unloader)

(Machine body: W1190 mm x D1190 mm x H1 720 mm)

Mass

2 200 kg (including loader / unloader)