Panasonic FCB3 0 pages
experts in productivity
nnTM
nnPanasonic Factory Solutions Company of America
nnFlip Chip Bonder nnHigh quality and high productivity bonding of narrow-pitch ICs
Accuracy of 3 յ m/3 o High-speed mounting at 1.8 s/chipՕ Adaptable to a wide variety of production styles The bonding head unit and die supply system are modular so that futurechangeovers to the latest process requirements will be easierՕ The clean running design and front-supply system for 300 mm wafers facilitate production changeover >
nnFCB3 nnMODEL NUMBERAPPLICABLE SUBSTRATE SIZE APPLICABLE IC SIZE
DRY CYCLE TIME BONDING ACCURACY IC SUPPLY METHOD NM-SB50A50 mm square to 330 x 250 mm1 mm square to 20 mm square1.8s/IC
3 m/3Up to 300 mm (12 inch) diameter2 inch square, 4 inch square5 N~ 490 Nup to 500հ C
1,635 mm1,980 mm1,800 mm Wafer supply Tray supply BONDING PRESSUREBONDING HEAD TEMPERATUREDIMENSIONS W D
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