PY0623 Die Datasheet0 pages

PY0623

PYROELECTRIC SENSOR DIE
PYR001_001 (INTEGRATED CAPACITOR)
Introduction
Pyreos is pleased to present our unique thin film pyroelectric sensor provided as bare die for
customer’s to assemble into their own package and die arrangement. This die has broad
absorption properties and may be suitable for a customer’s application in any part of the
infra-red spectral range. The die can be incorporated into TO packages or into surface
mount compatible packages. The die has an integrated on chip capacitor that is used in
sample wafer level manufacturing testing.
Please contact Pyreos if you require optimized performance from a custom die design.

Device Parameters:
Die size / type
Element size ( active area )

nom.
nom.

1.50 x 1.00 mm ± 0.05
700x325 µm

mean

373 pF ± 15%

Element dielectric loss {1kHz, 1V, 25 C}

mean

0.018

Operating / storage temperature

nom.

-25 ... +85oC

Element capacitance {1kHz, 1V, 25oC}
o

Please note: the information contained in this document is draft only and subject to change without
further notification. Pyreos reserves the right to alter the performance and any resulting specification.
Pyreos may choose not to supply any engineering sample devices as a commercial product. No
responsibility is accepted for any consequential loss incurred. Pyreos Ltd, SMC, West Mains Road,
Edinburgh EH9 3JF, UK. Tel:+441316507009, www.pyreos.com; © Copyright Pyreos Ltd 2010