VADU 300XL0 pages

Soldering technology

Inline soldering system VADU 300 XL
Automated soldering with vacuum
The soldering system VADU 300 XL is equipped with three separate process chambers
with internal substrate handling and inline
carrier transfer for highly efficient series
production. The system enables void-free
solder connections with preforms and /or
pastes in a continuous process. The reproducibility of the soldering processes is
guaranteed by permanent process control.

Optional automation solution
with view on the transfer of
the carrier from the lifting
station to the conveyor belt.

The VADU 300 XL can also be integrated in
customer‘s automation processes. PINK
develops solutions according to customer‘s
requirements which range from the optimization of the carrier handling through
surrounding transfer systems to link-up
with pick-and-place machines and robot
automation.

Technical data
Process area (W x D): 410 x 280 mm (e.g. 4 cards à 5 x 7 ”)
Clearance height: max. 100 mm
Dimensions of the system (W x D x H): 2,340 x 1,760 x 1,800 mm
Power supply: 3 x 400 V, 50 / 60 Hz
Power input: 25 kVA
Weight: 2,000 kg (without pumping unit)

PINK GmbH
Thermosysteme
Am Kessler 6
97877 Wertheim
Germany
T +49 (0) 93 42 919-0
F +49 (0) 93 42 919-111
vadu@pink.de
www.pink.de

System features
•• Void-free solder connections
•• Soldering with preforms and / or pastes
•• Individual soldering profiles
•• Soldering temperatures up to 400 °C
•• Controlled temperature gradients
•• Short cycle times
•• Separate soldering and cooling chamber
•• Formic acid process
•• Flux management
•• Inert gas atmosphere
•• Residual oxygen content < 5 ppm
•• Reproducibility of the soldering results
•• Traceability
•• Permanent process control
•• USB connection
•• Ethernet interface
•• Remote maintenance (VPN)
•• SMEMA interface
•• Low energy and media consumption
•• Internationally patented system
Options
•• Wafer up to 12 
“
•• Induction heating
•• High vacuum
•• Handling /   ransfer systems
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