VADU 200XL and VADU 200XL-W0 pages

Soldering technology

Batch soldering systems VADU 200 XL and VADU 200 XL-W
Vacuum supported soldering of substrates and wafers
The soldering systems of type VADU 200 XL
are equipped with two separate process
chambers and can be operated with paste
as well as preforms.
The VADU 200 XL -W enables the soldering
of wafers up to 12 . Therefor PINK produces
“
also customized carriers.
View into the process
chamber of VADU 200 XL .

Both soldering systems allow the precise
control of all relevant process parameters
e.g. the temperature gradients during
heating and cooling. Due to its intelligent
temperature management the system
provides short cycle times and an excellent
temperature stability.

View into the process
chamber of VADU 200 XL -W.

Technical data
Process area VADU 200 XL (W x D): 410 x 280 mm (e.g. 4 cards à 5 x 7 ”)
Clearance height: max. 100 mm
Dimensions of the system (W x D x H): 1,200 x 2,110 x 1,700 mm
Power supply: 3 x 400 V, 50 / 60 Hz
Power input: 10 kVA
Weight VADU 200 XL: 1,200 kg, Weight VADU 200 XL -W: 1,400 kg

PINK GmbH
Thermosysteme
Am Kessler 6
97877 Wertheim
Germany
T +49 (0) 93 42 919-0
F +49 (0) 93 42 919-111
vadu@pink.de
www.pink.de

System features
•• Void-free solder connections
•• Soldering with preforms and / or pastes
•• Individual soldering profiles
•• Soldering temperatures up to 400 °C
•• Controlled temperature gradients
•• Short cycle times
•• Separate soldering and cooling chamber
•• Formic acid process
•• Flux management
•• Inert gas atmosphere
•• Residual oxygen content < 5 ppm
•• Reproducibility of the soldering results
•• Traceability
•• Permanent process control
•• USB connection
•• Ethernet interface
•• Remote maintenance (VPN)
•• Low energy and media consumption
•• Internationally patented system
Options
•• Wafer up to 12 
“
•• Induction heating
•• High vacuum
•• Handling /   ransfer systems
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