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СРС81330
COM Express Type 6 Intel® Ivy Bridge CPU module
Features
Supports Intel® Ivy Bridge CPU onboard
Supports Intel® QM77 chipset
4GB DDR3 Memory IC onboard support ECC
Three Digital Display Interfaces (DDI)
1 x PCIe x16, 7 x PCIe x1
Wide operating temperature: –40°C to +85°C
(custom cooling solution is required)
Technical Specifications
Overview
CPC81330 is a PICMG COM Express
Module with size 95 x 125 mm (Basic
format) Type 6. Based on Intel® Ivy
Bridge CPUs up to 2.7 and Intel® QM77
chipset. Memory interface supports
dual channel 4GB DDR3 1600 Memory
IC onboard with ECC.
Multimedia functions are supported
by three DDI ports support HDMI/ DP/
SDVO/ DVI, flat panels with dual LVDS
interface (resolution up to 2048 х
1536) and Intel® High Definition Audio.
External graphic adapters can be con
nected through x16 PCI Express inter
face.
Peripheral devices can be connected
to CPC81330 through PCI Express
interfaces, 4 USB 3.0 ports, 8 USB 2.0
ports, LPC.
CPC81330 storage subsystem sup
ports two SATAIII and two SATAII inter
faces.
CPC81330 is a perfect solution not
only for industrial automation but also
for in vehicle computer applications,
for example, production automation,
data acquisition, access control,
mobile DVR, Kiosk, unmanned
machines and many more.
http://www.fastwel.com
System
Ethernet
• CPU Type:
®
• 3rd Generation Intel Core i7/i5/i3 processor,
BGA type
• Core i7 3517UE (2C x 1.7GHz), 4M L2 cache
(17W)
• Core i5 3610ME (2C x 2.7GHz), 3M L2 cache
(35W)
• Core i3 3210ME (2C x 2.4GHz), 3M L2 cache
(35W)
• Core i3 3217UE (2C x 1.66GHz), 3M L2 cache
(17W)
®
• Chipset: Intel QM77
• Memory Type: Dual channel 4GB DDR3
1600 Memory IC onboard support ECC
• BIOS: AMI® UEFI BIOS
• Super: I/O Fintek F81801 I
• Watchdog: 1 255 sec. or 1 255 min. soft
ware programmable and can be generate
system reset
• Expansion Slot: 1 x PCIe x16 (2 x PCIe x8 or
1 x PCIe x8 + 2 x PCIe x4)
• 7 x PCIe x1
Display
• Chipset: Integrated GFX in Ivy Bridge
processor
• VGA: Yes, Max: SXGA 2048 x1536@60Hz
• LVDS: Dual channel 24 bit LVDS
• DDI: Three DDI ports supporting HDMI/ DP/
SDVO/ DVI
Audio
• Codec Integrated Intel® High Definition
Audio
• Chipset: 1 x Intel® 82579LM GbE LAN
• WOL: Yes
• Boot from LAN: Yes for PXE
Internal I/O
• SATA:
• 2 x SATAIII
• 2 x SATAII
• USB:
• 4 x USB 3.0
• 8 x USB 2.0
• LPC bus: 1
• SMBus: 1
• I2C: 1
Mechanical and Environment
• Form Factor: COM Express Type 6
• Power Type: AT mode (12V), ATX mode
(12V & 5Vsb)
• Dimension: 125 x 95 mm
• Operating Temp.: –40°C to +85°C
(custom cooling solution is required)
• Storage Temp.: –40°C to +85°C
• Relative Humidity: 10% to 90%,
non condensing