Fico AMS-W Top Foil0 pages
Fico AMS-W Top Foil
The Art of Top Foil Molding
Future Proof Equipment
Molding is a process where micro chips are encapsulated in plastic.
Dedicated to the latest trend in single sided packages, the Fico
AMS-W is the most economic and flexible foil molding system. It is
the molding solution for products like QFN, BGA, BOC and BGA‑MAP,
including high end applications such as flip chip, multi array and
stacked die. The special foil molding feature allows bleed free
production of bare die molded underfill products.
Medical
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•t Individually moving blocks
•• 35% less moving parts
•• Modular mold design
•t Low cost PR-set
El
LED
to
•t Moving blocks
•• Complex handling
•• Large and heavy mold
•• Expensive PR-set
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Fico AMS-W
il e
Conventional
Sub
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The Fico Approach
Cer
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Optics
Au
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the art of
TOP FOIL MOLDING
CASSETTE
HANDLER
VISION
LEADFRAME
HANDLER
FOIL
UNITS
PELLET
SUPPLY
Besi
MOLDING
PRESS