Esec 2100 sDplus0 pages
DB 2100 sD
plus
/ sD PPP
plus
Future Proof Equipment
Driving Innovation
The latest member of the field proven standard machine for high end
production is combining the revolutionary Phi-Y Pick and Place with
the new 2nd generation vision system.
With the Parallel Pick & Place (PPP) option it also provides parallel
picking and bonding which increases productivity for ultra-thin die
plus
applications and improves the process quality. The DB 2100 sD
guarantees to remain to be the most flexible and capable Die Bonder
for high end devices for the time to come.
MEMS
Flash
memory
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Other
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•t Best ultra thin die productivity
•t Void free
•t Stress free – prevents die cracks
•t Accuracy 10 µm @ 3σ
Sub
•t Best standard die productivity
•t Common die bonding process
•t Standard accuracy: 15 µm @ 3σ
•t High Accuracy Mode: 12 µm @ 3σ
Parallel Pick & Place
ra
le
Single Pick & Place
M o bi
The only Two-in-One Die Bonder
oxy
Ep
Die
SiP
h Film
tac
At
Au
to
m
the Future of
high end DIE BONDING
ULTRA THIN
ULTRA THIN
DIE PICKING
DIE PICKING
PARALLEL
PARALLEL
PICK&PLACE
PICK&PLACE
HIGH PRECISION
BONDING
2nd GENERATION
VISION SYSTEM
CLEAN
CLEAN
MACHINE
MACHINE