Esec DB 2009 SSIE0 pages
Esec DB 2009 SSIE
Future Proof Equipment
Today’s power devices used in communications, automotive, computers,
home appliances and handheld devices have entered a new era of
miniaturisation. This development requires more power dissipation in
small packages and asks for a more stringent process control. Esec is
teaming up with key customers and major material suppliers to forge an
optimum power packaging solution. Such close cooperation led to the new
soft solder Die Bonder 2009 SSIE from the soft solder world market leader.
New Era of Miniaturisation
Enhancements
MOSFET
PQFN
Pow
e
Power
SO
St
TO-247
C
rI
an
TO3P
dard po w
TO
SOT
DPAK
Features
•t New dispense system
•t Best process control
•t Product inspection
SIP
IGBT
power
gh
Hi
The soft solder DB 2009 SSIE is engineered for a variety of packages
like SOT, SOD, SO, PSSO, PSOP, DPAK, TO, PQFN, Power LED and power
modules on one platform. Our leading edge patented process technology
and our dedication to provide solutions to our customers, help to
produce power devices at the lowest price and highest performance.
er
Solution Provider for Power Package
•t High bond force (150N)
•t 300mm capability
•t Special applications (boat and
reel-to-reel handling)
the ART of
Soft solder DIE BONDING
PATTERN
WRITING
VISION
ALIGNMENT
VISION
ALIGNMENT
PATTERN
DISPENSING
QUICK
EXCHANGE
PRODUCT
INSPECTION
QUICK
EXCHANGE
PRODUCT
INSPECTION
OVEN AND
ATMOSPHERE
POINT TO LINE
PICK & PLACE
POINT TO LINE
PICK & PLACE
OVEN &
ATMOSPHERE
Esec
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