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Esec DB 2009 fSE0 pages
Esec DB 2009 fSE
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The development of the Esec DB 2009 fSE is based on more than
30 years of experience. One important contributor to lowest cost of
ownership is the significant reduction of gas consumption of up to
50% compared to competing systems, which means massive savings in
operating costs every day.
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The ever more demanding market requirements led to the evolution
of the Die Bonder 2009 fSE, the fastest soft solder die bonder in the
industry with a broad application range. First to mention is the pointto-line Pick & Place with stationary indexer, which enables increased
throughput and productivity. Furthermore, the Die Bonder 2009 fSE
handles both single row and matrix leadframes, as well as a wide
variety of packages like SOT-23, SOT-223, SOT-89, TO-92, TO-126,
TO-220 and DPAK devices. The optional leadframe conversion kits offer
an effective solution for future changes in the product mix.
Future Proof Equipment
Pow
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Fastest Soft Solder Die Bonder with a Wide
Application Range
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SOT
DPAK
Increased Throughput & Productivity
Enhancements
•t New dispense system
•• Best process control
•• Significantly higher throughput for matrix leadframes
the ART of
Low cost operation
PATTERN
WRITING
POINT TO LINE
PICK & PLACE
PATTERN
DISPENSING
POINT TO LINE
PICK & PLACE
QUICK
EXCHANGE
LOW OPERATING
COST
$
QUICK
EXCHANGE
OVEN AND
ATMOSPHERE
OVEN &
ATMOSPHERE
Besi
LOW OPERATING
COSTS
