ZVS-200S0 pages
Z Y G O C O R P O R AT I O N ’ S
HVM in-tray
inspection solution
for FC-BGA
—
Industry leading throughput
(>5,000 UPH)
—
Highest reliability at lowest
cost of ownership
—
Parts measured in-tray with
minimal handling
—
FMI-3™ 2D/3D high-speed,
high-accuracy sensor
—
Advanced C4 bump inspection
for Solder Paste, Micro-ball,
Cu-Pillar and other processes
—
Flexible platform supporting
bumps on Coreless BGA,
SGA, PGA
—
Extensive 2D/3D metrology for
flattened and round bumps
—
Unconstrained
coplanarity/warpage
measurements
—
SECS/GEM and SEMI S2-S8
compliance available on request
Zygo Corporation introduces the next generation of fully-automatic
in-tray vision system for inspection of flip-chip substrates. Now with
in-tray inspection, ZYGO’s ZVS-200S vision system is an industry
leading high throughput, high accuracy tool dedicated to the
inspection of C4 round and flat bumps.
With today’s ongoing trends in decreasing feature sizes and higher
I/O requirements, the flip-chip substrate industry faces an important
challenge of achieving greater quality through improved process
control in substrate manufacturing production.
The ZVS-200S vision system is ready to meet that challenge with
industry leading accuracy and repeatability at never before reached
throughputs for total quality control and lower cost of ownership. The
ZVS-200S vision system is designed for the inspection of singulated
substrates inspected in the production trays. This allows for a faster
tool, better metrology measurements and unconstrained warpage
inspection. The end result is total quality control for the flip-chip
substrate manufacturer at best cost of ownership.