Nano0 pages
Z Y G O C O R P O R AT I O N ’ S
The utmost precision
3D/2D inspection
system for singulated
part, strip, panel,
and wafer format
inspection
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Integrating ZYGO’s new FMI-3
technology for best available
accuracy
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Complete 2D/3D bump metrology
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Supports singulated part, strip,
panel, and wafer formats
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Flexible platform supports C4,
BGA, LGA, SGA, QFN, QFP, SPI,
CSP, and other types of bumps &
pad inspection
—
All types of FMI sensors available
Zygo Corporation introduces the next generation of
semi-automatic vision system for inspection of all types of
packages. Now with new FMI-3 technology, ZYGO’s Nano-3
vision system is an industry leading precision inspection tool
dedicated to meet inspection requirements for process
monitoring, quality control, and new product development.
With today’s ongoing trends in decreasing feature sizes and
higher I/O requirements, the flip-chip substrate industry faces an
important challenge of achieving greater quality through improved
process control in substrate manufacturing production.
ZYGO’s Nano-3 vision system is ready to meet that challenge
with industry leading accuracy and repeatability, and flexibility
supporting all types of package inspections. The Nano-3 vision
system is designed for the inspection of packages on production
tray, strip, panel, or wafer. This allows customers to have a
multiple function tool for their process control and new product
development at best cost of ownership.