3000_plus0 pages
semiconductor
Development and production
of laser and sorting systems
IL 3000 Wafer Marking System
The Innolas IL 3000 (Plus) series laser system is designed to mark 300mm Silicon wafers.
The IL 3000 (Plus) provides deep or debris free marking with the possibility to simultaneously mark
the front and backside of a 300mm wafer in a single process step.
A unique InnoLas Semiconductor designed 300mm
vacuum or edge grip handling (including aligner) is
available. Both handling systems provide front and/
or backside marking capability.
The wafer marking system is controlled by a 19“ industrial PC.
The powerful WindowsTM based software package includes user
friendly operator and engineer interface along with sophisticated
diagnostic features for maintenance and service personal.
Software options include wafer sorting and SECS/GEM host interface. Customized software solutions are available upon request.