Spi-Stringer 20000 pages
Spi-Stringer™ 2000
Semi-Automated Solar Cell Stringer
T
he Spi-Stringer™ 2000 is a semi-automated stringing
machine that interconnects solar cells by soldering
flat metal leads, or ribbons, to cell contacts. Solar cells are
processed with high yield.
The operator places individual solar cells onto a combination
alignment chuck and robot pick-up stage. The Spi-Stringer
picks the cell from the chuck and places it onto the
conveyer belt. Ribbon material is automatically fed from
spools, coated with flux, cut to length, and provided with a
stress-relief bend. Ribbons and cells are aligned for soldering.
High-intensity lamps in the solder head assembly provide
radiant thermal energy to the cells and ribbons. Both front
and back cell contacts are soldered in a single step, thereby
Solar cells processed with high yeild
(Offload conveyer not shown)
reducing thermal stress on cells. The number of cells per string,
cell spacing, ribbon length, stress bend location, and soldering
parameters are all software programmable. Each completed
string is automatically fed to an offload conveyer, where an
operator will remove it by hand and transport it to the next
stage of the process (inspection, glass layup, etc).
Options
•
Third Ribbon Path
Allows additional interconnect ribbon on
larger cells with greater current output
F E AT U R E S A N D B E N E F I T S
Software Programmable
Automated and programmable assembly creates high quality soldered
cell strings for multiple cell sizes
Software selectable string design including ribbon length, stress-relief bend location,
number of cells per string, cell spacing, and soldering parameters
Computer controlled with a touch screen graphical interface
Flexible Operation
Solar cells are aligned and automatically placed into strings prior to soldering
Easily adaptable to a wide range of cell and string designs
Remote diagnostics and service capability
Soft Touch on Cells
High-intensity light soldering with cell pre-heating for improved throughput and yield
Rapid soldering process - Minimum mechanical force on cell
Low thermal stress - Continuously soldered contacts
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©2010 Spire Corporation. All rights reserved. Specifications are subject to change without notice.
Rev C 3/10
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