150MHz, 200V/µs, 2A Power Amplifier0 pages

PA09 • PA09A
PA09 • PA09A

PA09, PA09A

Power Operational Amplifier
FEATURES
•t POWER MOS TECHNOLOGY — 2A peak rating
•t HIGH GAIN BANDWIDTH PRODUCT — 150MHz
•t VERY FAST SLEW RATE — 200V/µs
•t PROTECTED OUTPUT STAGE — Thermal shutoff
•t EXCELLENT LINEARITY — Class A/B output
•t WIDE SUPPLY RANGE — ±12V to ±40V
•t LOW BIAS CURRENT, LOW NOISE — FET input

APPLICATIONS
•t VIDEO DISTRIBUTION AND AND AMPLIFICATION
•t HIGH SPEED DEFLECTION CIRCUITS
•t POWER TRANSDUCERS TO 2MHz
•t COAXIAL LINE DRIVERS
•t POWER LED OR LASER DIODE EXCITATION

DESCRIPTION
The PA09 is a high voltage, high output current operational
amplifier optimized to drive a variety of loads from DC through
the video frequency range. Excellent input accuracy is achieved
with a dual monolithic FET input transistor which is cascoded
by two high voltage transistors to provide outstanding common
mode characteristics. All internal current and voltage levels are
referenced to a zener diode biased on by a current source. As
a result, the PA09 exhibits superior DC and AC stability over
a wide supply and temperature range.
High speed and freedom from second breakdown is assured
by a complementary Power MOS output stage. For optimum
linearity, especially at low levels, the Power MOS transistors
are biased in the class A/B mode. Thermal shutoff provides
full protection against overheating and limits the heatsink
requirements to dissipate the internal power losses under
normal operating conditions. A built-in current limit protects the
amplifier against overloading.Transient inductive load kickback
protection is provided by two internal clamping diodes. External
phase compensation allows the user maximum flexibility in
obtaining the optimum slew rate and gain bandwidth product
at all gain settings. For continuous operation under load, a
heatsink of proper rating is recommended.
This hybrid integrated circuit utilizes thick film (cermet) resistors, ceramic capacitors and silicon semiconductor chips to
maximize reliability, minimize size and give top performance.
Ultrasonically bonded aluminum wires provide reliable interconnections at all operating temperatures. The CE, 8-pin TO-3
package is hermeti+37V
di
= 2A/µs
CC 5pF
cally sealed and elecdt
3
trically isolated. The
7
4
i = Vi /RS
8
use of compressible VI
1
thermal washers and/
PA09
5
CF
LY
or improper mount470pF
13µH
ing torque will void
6
RD
1Ω
the product warranty.
–37V
RF
3.9K
Please see “General
Operating Consider100Ω R
S
ations”
.
.5Ω
FIGURE 1. PA09 AS DEFLECTION AMPLIFIER

www.apexanalog.com
PA09U

8-PIN TO-3
PACKAGE STYLE CE
DEFLECTION AMPLIFIER (FIGURE 1)
The deflection amplifier circuit of Figure 1 achieves arbitrary beam positioning for a fast heads-up display. Maximum
transition times are 4µs while delivering 2A pk currents to the
13mH coil. The key to this circuit is the sense resistor (RS)
which converts yoke current to voltage for op amp feedback.
This negative feedback forces the coil current to stay exactly
proportional to the control voltage. The network consisting of
RD, RF and CF serves to shift from a current feedback via RS
to a direct voltage feedback at high frequencies. This removes
the extra phase shift caused by the inductor thus preventing
oscillation. See Application Note 5 for details of this and other
precision magnetic deflection circuits.

EQUIVALENT SCHEMATIC
2
3

D1

C1

Q5

Q3

Q2

Q1

Q4

7

Q6

8

Q7

Q13
Q8
Q12A
5

Q9

Q11

Q12B

C2

1

Q14

Q17

Q10

Q19

D3

4

Q15

Q16
D2

Q18
6

EXTERNAL CONNECTIONS
CC

RC

7

CC

8

–VS

6

5 –IN

RS

TOP VIEW

4
OUT

1
2

BAL

+IN

RT

3
+VS

RS = (│+VS│ + │–VS│) RT /1.6

NOTE: Input offset voltage trim optional. RT = 10KΩ MAX

Copyright © Apex Microtechnology, Inc. 2012
(All Rights Reserved)

SEP 2012
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PA09U REVP