30A, 150V, Power Amplifier with High Internal Power Dissipation0 pages

PA03 • PA03A
PA03 • PA03A

PA03, PA03A

Power Operational Amplifiers
FEATURES
•t MO-127 COPPER POWER DIP™ PACKAGE
•t HIGH INTERNAL POWER DISSIPATION
t   — 500 watts
•t HIGH VOLTAGE OPERATION — ±75V
•t VERY HIGH CURRENT — ±30 amps
•t INTERNAL SOA PROTECTION
•t OUTPUT SWINGS CLOSE TO SUPPLY RAILS
•t EXTERNAL SHUTDOWN CONTROL

12-PIN DIP
PACKAGE STYLE CU

APPLICATIONS
•t LINEAR AND ROTARY MOTOR DRIVES
•t YOKE/MAGNETIC FIELD DEFLECTION
•t PROGRAMMABLE POWER SUPPLIES to ±68V
•t TRANSDUCER/AUDIO TO 1000W

TYPICAL APPLICATION

POSITION
FEEDBACK

+VS

DESCRIPTION

RBAL

The super power PA03 advances the state of the art in
both brute force power and self protection against abnormal
operating conditions. Its features start with a copper dip package developed by Apex Microtechnology to extend power
capabilities well beyond those attainable with the familiar
TO-3 package. The increased pin count of the new package
provides additional control features, while the superior thermal
conductivity of copper allows substantially higher power ratings.
The PA03 incorporates innovative current limiting circuits
limiting internal power dissipation to a curve approximating
the safe operating area of the power transistors. The internal
current limit of 35A is supplemented with thermal sensing
which reduces the current limit as the substrate temperature
rises. Furthermore, a subcircuit monitors actual junction
temperatures and with a response time of less than ten milliseconds reduces the current limit further to keep the junction
temperature at 175°C.
The PA03 also features a laser trimmed high performance
FET input stage providing superior DC accuracies both initially
and over the full temperature range.

EQUIVALENT
SCHEMATIC

8
11
12

OBJECT
TOOL

+
+S

+5V
SHUT DOWN
0/10V
DAC
R1
DESIRED
POSITION

–S PA03
–
–VS
C1
R2

The PA03 output power stages contain fast reverse recovery
diodes for sustained high energy flyback protection.
This hybrid integrated circuit utilizes thick film resistors,
ceramic capacitors and silicon semiconductors to maximize
reliability, minimize size and give top performance. Ultrasonically bonded aluminum wires provide reliable interconnections at all operating temperatures. The MO-127 Copper,
12-pin Power Dip™ package (see Package Outlines), is
hermetically sealed and isolated from the internal circuits.
Insulating washers are not recommended.
IMPORTANT: Observe mounting precautions.

+V
BAL

Q4

Q1

BAL
D1
Q3

Q2

Q12
Q5

1

2

–

Q17
Q20
A

Q20
B

+

4
+SHUT
Q18 DOWN

Q14

COMP
10

Q22

Q19

Q29

Q31

Q30

Q32

OUT

6
–

Q24

3
–SHUT
DOWN

D2

+
7

Q16

9

D4
5

Q9

Q6 Q7

Q26

D3

Q34

–V

www.apexanalog.com
PA03U

Copyright © Apex Microtechnology, Inc. 2012
(All Rights Reserved)

SEP 2012
1
PA03U REVL