MODEL 626 MULTIPURPOSE DIGITAL THERMOSONIC WIRE BONDER0 pages

Soft Touch™
MODEL 626 MULTIPURPOSE
DIGITAL THERMOSONIC WIRE BONDER
Ball Bonder, Wedge Bonder, Bump or Stud Bonder, Peg Bonder and more
STANDARD FEATURES:
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Motorized Z control in auto and manual modes (fast & slow speeds for manual).
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75 bond schedules programmable in non-volatile memory
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Selectable/adjustable Reset Heights (Constant or Adaptive).
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1-2-2 auto stitch or manual continuous stitch in manual & auto modes when ball bonding.
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Sensor bond actuation for variable bond height
bonding.
! Audio and visual bond indicators.
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Static dissipative enclosure.
! 0.740 inch max. vertical bonding window.
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Vertical deep access of 0.53 inch when using a 0.750 inch capillary.
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Horizontal reach of 6.5 inches.
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Programmable loop and search heights.
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Built-in digital temperature controller.
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High/low power PLL ultrasonic generator.
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Swing away wire/ribbon clamps.
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2 inch and 0.5 inch inertial spool holders.
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Z control by foot-switches or manipulator.
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Ball, Wedge, Bump or Peg bond capable.
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Electronic ball size control 0-4x wire diameter.
Model 626 is a Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder. The 626 can be used for wire diameters from 0.7 to 2.0 mil (18 to 51ìm) gold wire when in Ball bonder configuration, or wire diameters from 0.5 to 3.0 mil (12,7 to 76ìm) and ribbon up to 1.0 x 20.0 mil (25,4 x 510ìm) for Wedge or Peg bonding configuration. The 626 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's and LED's. Model 626's motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and allow the operator to increase or decrease tail length in 1 mil (25ìm) increments at a touch of a switch. The 626 shows actual units for set up of bond parameters. The change over from Ball bonder to Wedge bonder requires only a press of a button to turn EFO power to zero and a change from capillary to wedge tool. So versatile it can also operate in Bump or Peg bonding modes. For pick, place and bond feature add OP-47.
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