Touchâ„¢ DIGITAL THERMOSONIC WIRE & RIBBON WEDGE BONDER 6760 pages

Soft Touch™
DIGITAL THERMOSONIC
WIRE & RIBBON WEDGE BONDER
For 0.5 to 3.0 mil (12,5 to 75ìm) diameter Wire and up to 1x12 mil (25x304ìm) Ribbon
STANDARD FEATURES:
!
Motorized Z control in auto and manual modes (fast & slow speeds for manual).
!
Bond schedules programmable in non-volatile
memory
! Selectable/adjustable Reset Heights (Constant or Adaptive).
!
1-2-2; 1-2-1 & 1-1-2 auto stitch or manual continuous stitch in manual & auto modes.
!
Sensor bond actuation for variable bond height bonding.
!
Audio and visual bond indicators.
!
0.740 inch max. vertical bonding window.
!
Vertical deep access of 0.53 inch when using a 0.750 inch capillary.
!
Horizontal reach of 6.5 inches.
!
Programmable loop and search heights.
!
Built-in digital temperature controller.
!
High/low power PLL ultrasonic generator.
!
Swing away wire/ribbon clamps.
!
2 inch and 0.5 inch inertial spool holders.
!
Z control by foot-switches or manipulator.
!
Static dissipative enclosure
Model 676 is a Deep Access, Long Reach Thermosonic Wedge Bonder for wire diameters from 0.5 to 3.0 mil (12 to 76ìm) and ribbon up to 1.0 x 12.0 mil (25 x 300ìm) featuring HYBOND's unique Soft Touchtm energy system. The 676 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and bonding wires to sensitive devices such as gallium arsenide FET's and LED's. Model 676's motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and also allow the operator to increase or decrease tail length in 1 mil (25ìm) increments at a touch of a switch. The amount of clamp "pull-back" required to break the wire at final bond may also be varied in relation to wire elasticity allowing the use of softer wires (higher elongation) than conventionally used in wedge bonding. The 676 shows actual units for set up of bond parameters.
PALOMAR
TECHNOLOGIES