S-3 HDI? Yarn0 pages
PRODUCT INFORMATION
agy
in materials
S-3 HDI™ Yarn
Low CTE, High Modulus Glass Fiber Yarn
for IC Substrate PCB Applications
AGY’s S-3 HDI™ yarns are specically
designed to meet the demanding
performance requirements of IC
substrate PCBs.
Product Application
The use of smartphones and tablet
PCs continues to grow globally. In
addition, the functionality of these
devices continues to increase, which
has created the need for smaller and
highly specialized PCBs. IC substrates
are utilized as the connection
between the IC chips and the PCB,
and represent state-of-the-art
miniaturization in PCB design. Often
referred to as chip scale package,
package-on-package, or multi-chip
package solutions, these PCBs are
routinely found in smartphones and
tablet PCs.
Product Description
S-3 HDI yarns are produced using a
proprietary, patent pending glass
Features
Benets
CTE = 3.5 ppm/OC vs. 5.4 ppm/OC for
E-Glass
Minimizes CTE mismatch with
silicon chips, improving
substrate reliability
Tensile Modulus = 86 GPa vs. 72 GPa
for E-Glass
Enables thin substrates with
minimum warpage at elevated
temperatures
Low hollow bers
Excellent conductive anodic
lamentation (CAF) resistance
Wide range of ber micronage and
yield/tex
Wide range of possible
substrate thicknesses
Highly homogeneous glass quality
Consistent performance in PCB
applications
Treated with electronics grade starch/
oil sizing
Fabric surface smoothness with
high-speed air-jet weaving
composition designed for the specic
requirements of low coefcient of
thermal expansion (CTE) and high
tensile modulus. S-3 HDI yarns are
available in a wide range of ber
micronage and yield/tex, including
ultra-ne yarns for the thinnest
substrates.