عضویت 
ورود اعضا
راهنمای خرید
SECOMExp-RSeries0 pages
COM Express
Type 6
SECOMExp-RSeries
COM-Express™ Type 6 Module based on
the AMD Embedded R-Series Platform
CPU
AMD Embedded R-Series Dual / Quad core
64-bit CPU
Graphics
Integrated AMD GPU Radeon™ - HD7000
Memory
up to 8GB of 1600MHz DDR3 on two SODIMM slots, supporting Dual Channel
Temperature
Available in commercial version, 0°C ÷
+60°C
X86
HIGHLIGHTS
FEATURES
Latest AMD R-series APU (CPU+GPU)
architecture
•t
Up to 4 independent displays, up to
2560x1600 resolution
Max Cores
4
•t
Chipset
AMD A70M Controller Hub
Designed for digital signage, gaming and
multimedia applications
Memory
Graphics
Video Interfaces
Video
Resolution
up to 8GB of 1600MHz DDR3 on two SO-DIMM slots @1.5W,
supporting Dual-Channel
AMD Radeon™ HD7000G Series:
t
HD7660G - AMD R-464L / HD7640G - AMD R-460H
t
HD7620G - AMD R-460L / HD7600G - AMD R-452L
t
HD7500G - AMD R-260H / HD7400G - AMD R-252F
Up to 4 independent display supported
DirectX® 11, OpenGL 4.2, OpenCL™ 1.1 supported
3 x Digital Display Interfaces
18/24 Bit Single/Dual Channel LVDS interface
CRT interface
PCI Express Graphics (PEG) x 8 interface
LVDS Interface, up to 1920x1200
CRT interface, up to 1920x1600
Digital Display interfaces, up to 2560x1600
4 x external S-ATA channels
Networking
Gigabit Ethernet interface
USB
8 x USB 2.0 Host Ports
4 x USB 3.0 Host Ports
PCI-e
7x PCI-e x1 lanes (configurable as 1 PCI-e x4 + 3 PCI-e x1)
Audio
HD Audio Interface
Serial Ports
2 x optional Serial port (TX/RX only, TTL interface)
Other Interfaces
2 x Express Card interfaces
I2C Bus
LPC Bus
SM Bus
4 x GPI, 4 x GPO
Thermal /Fan Management
SPI Interface
Watch Dog Timer
Real Time Clock
Optional Trusted Platform Module (TPM)
Power Management Signals
Power Supply
+12VDC ± 10% and + 5VSB (optional)
Operating
System
Microsoft® Windows® XP (32/64 bit)
Microsoft® Windows® 7 (32/64 bit)
Microsoft® Windows® 8 (32/64 bit)
Linux (32/64 bit)
Operating
Temperature*
0°C ÷ +60 °C (commercial version)
Dimensions
125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual
temperature will widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.
Biomedical/
Medical
devices
Digital Signage Infotainment
Gaming
050.15
Mass Storage
MAIN FIELDS OF APPLICATION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
•t
Processor
AMD R-464L, Quad Core @ 3.2 GHz, TDP 35W
AMD R-460H, Quad Core @ 2.85 GHz, TDP 35W
AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W
AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W
AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W
AMD R-252F, Dual Core @ 2.4 GHz, TDP 17W
Please visit www.seco.com for thermal dissipation information
www.seco.com
"
