FlexTRAK-2MB Plasma Treatment System0 pages

March®
A NORDSON COMPANY
DUAL LANE BOAT PROCESSING WITH MULTIPLE IN-LINE PLASMA MODULES
HIGH THROUGHPUT IN-LINE PLASMA PROCESSING
The FlexTRAK-2MB plasma system’s integrated boat handler
provides rapid material transfer for a wide range of boat sizes,
up to 2 boats per plasma cycle. Processing can be done with
most types of boats, trays and flat carriers. The patented
chamber design and control architecture enable short plasma
cycle times, ensuring that throughput is maximized and cost
of ownership is minimized.
FEATURES AND BENEFITS
• Unique boat “by-pass” feature optimizes productivity
• Multiple in-line plasma modules increase throughput
• Highly uniform plasma treatment
• Production-ready dual lane boat handling
• Low cost of ownership
• Ideal for pre-Flip Chip underfill (FCUF) processes
The FlexTRAK-2MB plasma system is designed for high
throughput in-line processing of microelectronic devices held
in boats, trays, or other carriers, up to 2 boats per plasma
cycle. The patented plasma module provides exceptional
uniformity and run-to-run process repeatability. Its advanced
three axis symmetrical plasma chamber ensures highly
uniform plasma treatment, and control over all process
parameters ensures highly repeatable results.
The FlexTRAK-2MB plasma system seamlessly integrates
into your production line, while accommodating a wide range
of boat sizes, yielding unmatched production flexibility. Its
compact plasma chamber and proprietary process control
system minimize cycle times. The system provides fully
automated plasma processing via SMEMA 1.2 protocol.
APPLICATIONS
Plasma processes for pre-Flip Chip underfill (FCUF),
pre-die attach, pre-wire bond, and pre-mold steps.
Plasma Contamination Removal & Cleaning
• Fluorine & other halogens
• Metals & metal oxides
• Organic compounds
Plasma Etching
• Roughen surfaces to improve adhesion and
reduce delamination
• Modify surfaces to increase bondability
and make surfaces more wettable
Surface Activation by Plasma
• Improve Flip Chip underfill performance to eliminate
voids, enhance adhesion, increase wicking speed,
and increase fillet height uniformity
• Improve adhesive flow to eliminate voids and
enhance adhesion
• Improve mold material flow to eliminate voids
and reduce wire sweep
FlexTRAK-2MB
Plasma Treatment System