FasTRAK Plasma System0 pages

FasTRAK™ Plasma System
Features and Benefits

Flexible configuration accommodates the
full range of strip dimensions and
magazine designs
Advanced robotic handling system
minimizes strip handling, pushing, pulling
and reduces operator intervention
New camera-based material tracking
provides 100% plasma treatment
validation
High-efficiency, application specific,
plasma chamber design offers Direct or
Ion Free plasma treatment modes
Significantly smaller system footprint and
magazine reuse capability save space
and help lower cost of ownership

High Reliability Strip Handling
The FasTRAK™ system is a fully-automated, highthroughput, plasma treatment system for lead-frame
strips, laminate substrates, and other strip-type
microelectronic components.
Measuring 1.65 meters wide by 1.5 meters deep the
FasTRAK system has a >35% smaller system footprint
than previous strip processing models. The capability to
reuse magazines further reduces the effective footprint
as the empty magazines do not need to be staged at the
system.
Using state-of-the-art robotic movement that virtually
eliminates operator handling of the strips or magazines,
the FasTRAK system accommodates the full-known
range of magazines and strip width, length and thickness
dimensions.
The FasTRAK system makes it easy to change over to
accommodate a new magazine or strip size - recipes are
software driven and the system requires minimal
hardware interaction or tooling.

The field-proven robotics were specifically designed to
lower the handling risk to sensitive substrate materials by
using minimal movement, pushing, pulling and low Gforces.
The FasTRAK system features an innovative new
material tracking software application and internal
camera to count the number of strips and track their
progress throughout the entire treatment process,
providing 100% treatment validation. Up to 10 strips can
be accommodated per batch with an industry leading
units per hour (UPH) treatment rate.
The FasTRAK system also includes a new highefficiency, application-specific, plasma chamber that can
be configured for Direct or Ion-Free plasma modes.
Plasma Processes Include

Pre-die attach for improved adhesion
Pre-wire bond for higher pull strength and CpKs
Pre-mold to reduce delamination
Post-mold to remove flash
Pre-underfill to reduce voiding