RollVIA Plasma System0 pages

RollVIA™ Plasma System
Features and Benefits

High to low volume roll-to-roll vacuum
plasma
Available in three (3) configurations to
meet a wide variety of customer
production requirements
Proven web handling technology
Patented plasma systems produce
superior process uniformity
Flexible PCB applications include
surface activation, cleaning and
desmear
Small footprint system with integrated
pump package

Superior Plasma Uniformity for Roll-to-Roll
PCB Treatment
Nordson MARCH’s RollVIA™ system is specifically
configured to meet the demands of today’s most
advanced roll-to-roll production PCB manufacturing
operations. Plasma treatment uniformity is a key
operational feature in surface activation, desmear and
etchback applications for flexible circuit board
manufacturing technologies.
The integrated roll-to-roll material handling system
ensures precise control of roll speed, tension, and edge
guidance for substrates as thin as 25 µm. Optical based
edge guide detection allows for reliable control during
rewind operations. Substrate loading is simple with easy
access to the load and unload sections via four doors.
Unlike any existing competitive products, the RollVIA
system is completely self-contained. The vacuum system,
plasma chamber, control electronics, and 40 kHz power
supply are housed in a single enclosure. Full front and
rear access allows for convenient service to all interior
components. The pump is positioned on rollers for easy
removal.
Application Specific Technology
The RollVIA system incorporates the best of Nordson
MARCH’s market leading-edge plasma technology

combined with novel application specific technology
development based on our greater than 25 years of
experience. Through extensive research and
development, the RollVIA system presents unique
vacuum and gas flow technology, new electrode designs,
and superior temperature management. The careful
balance of these critical design elements and process
recipe parameters delivers a system that creates the most
uniform treatment for key applications like desmear and
landing pad cleaning.
The RollVIA system’s superior performance capabilities
are complemented by very attractive low-cost-ofownership aspects. The system features a very compact
and service-friendly design. The vertical loading concept
allows for equal treatment on both sides of the substrate
maximizing product quality and throughput. The fast
vacuum pump down and greatly enhanced process cycle
times further add to the throughput and productivity of
the system.
Additional Features
Equipped with a touch-screen PC Operator Interface,
the RollVIA system provides a wide breadth of control
capability and data collection. Unlimited recipes can be
stored for easy switching of plasma processes from batch
to batch. Password protection ensures that no
unauthorized entries can be made.