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HFC Thermally Conductive Encapsulating & Potting Compound0 pages
Thermally Conductive Encapsulating & Potting Compound
^PS-Hfittii*®, qJWSffl^PC(Poly-carbonate), PP, ABS, PVC^*t?4S.^^*fi<J*Sc iifflT<&7 Kft#&, RPl^ftwr
Wj*gUL94V-0*Bo iSROHSt§<$-S*o
Thermally Conductive Encapsulating & Potting Compound that is composed of two components with low viscosity and inflaming retarding materials,
can cure at both room temperature and high temperaturelthe latter can decrease the cure time). No by-product would be caused during the cure
reaction of the compound which could be used in the surface of various materials such as PC(Poly-carbonate), PP. ABS, PVC and primary applications
are electronic parts for heat conducting, insulating, waterproofing and inflaming retarding. It can achieve UL94V-0 and be RoHS compliant absolutely.
7*554$^_Benefites
• SSfW^^tt^DPfiiill • Excellent Conductivity and Flammability
• iJS^'ftS? • Low viscosity, excellent levelling property
• Bftf^jSSIfcrftflSflSW, taJtSttSf • Cured soft rubber-like materials with excellent impact resistance
• BtJ&tS, SBiStt, • Good heat resistance, moisture resistance, cold resistance
• ScSS, 8f%S, Stiffl ^fafot-f-k^jYJSttffi . Good chemical properties such as insulated, moistureproof, seismic
• Pft4f73 3i resistance, corona resistance, antileakage
• Excellent adhesive power
Typical Applications
TV, CRT, amis
Power Module, Electron Component deep section cure, especial for HID power
module cure
Cure of outdoor LED display screens
Mechanical adhesive of TV, CRT, power, communication apparatus and
electronic/electric components, and adhesive bonding of electronic components
Adhesive sealing of metal, plastic, glass with requirement of inflaming retarding.
m^-fcBUJn££7|^N& Technical Properties before/after Curing
f4&g?£*f.Properties | HJ100 | HJ200 | |||
Component A | Component B | Component A | Component B | ||
Before curing | Appearance | Dark grey fluid | White fuild | Dark grey fluid | White fuild |
mmm Operating performance | A*I#: Bil^llittl Component A:B|Weight ratio} | 1:1 | 1:1 | ||
y&.-frfrt&S (cos) Viscosity as Mixedlcps) | 3000 -4500 | 5000 - 6000 | |||
^£lWa](min) Working life (min) | 100 | 100 | |||
@1WB] (min) Cure Timelminl | 30-120 | 30-120 | |||
H-fcEhfia] ( min^Ot ) Cure time (min.SOT) | s=20 | s=20 | |||
mm After curing | 5fJf (shore C) Hardnesslshore CI | 30-40 | 30-40 | ||
#lif!![W(m.K]| Conductivity (W (m.K) 1 | 1.0 | 2.0 | |||
fflSf 1 kv/mm ) Dielectric strength ( kv/mm ) | S 27 | S 27 | |||
1.2MHz) Dielectric constant I 1.2MHz 1 | 3.0-3.3 | 3.0-3.3 | |||
(tfRi&ll* ( O.cm) Volume Resistivity ( Q.cm ) | >1.0x10" | S*1.0x10" | |||
Haste* UL | 94V-0 | 94V-0 | |||
ff ffljgJf ( °C ) Temperature Range | -55-250 | -55-250 | |||
Ptt: arUtffiffigP^3cSiJSi3'fW|B]ifoJigiy5.#SliSiii; *Cure time/hardness/conductivity can be custom-made.
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