Solar PSM100 pages

Hanuuha TechM

Multi Wire Sawing System

Specification

Dimension

Main Roller Management

Wire Management

Slurry Management

GUI

NewPSMlO

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Chinese

Korean

Multi Wire Saw: PSM10

An Advanced Cutting Machine for Solar Wafers

An equipment that cuts polysilicon bricks into wafers (120~180f<m) which are the

base of solar cells

The multi wire saw is used for the watering process where polysilicon bricks are

used to produce wafers with a thickness of 120~180um to be used as the base of

solar cells. The PSM10 model processes 1,000mm bricks placed in series. Diamond

wires can be applied to the multi wire saw.

New design concept

Maximum yield and highest wafer quality

Convenient optimal structure

User-friendly operating system