SA 80 Toughened Low Energy Cure Epoxy Adhesive Film (v11)0 pages
Datasheet level 1
SA 80
TOUGHENED EPOXY ADHESIVE FILM
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Low temperature cure
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Designed for bonding prepreg skins to honeycomb and certain cores
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Compatible with SE 84LV, SE 91 & SE 85 prepregs & ST 93 SPRINT™ products
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Toughened for impact resistance and peel strength
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Controlled flow for maximum bond integrity
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Lloyd’s Register Certified
INTRODUCTIONt
SA 80 adhesive film is a toughened film unsupported or on a glass carrier with excellent tack and drape characteristics.
It offers many advantages over traditional wet lay-up techniques for
bonding of composite skins to cores, including; consistent bond-line
thickness and weight, high strain to failure, high toughness, handling
convenience, controlled flow and an 8 week out-life at ambient
temperature (18-22ºC/64-72ºF).
PDS-SA80-11-0314
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