Adhesives advertisement0 pages
Electronics
nnnnSolutions
nnnnDOW CORNING
nnnnDow Corningf EA-6052 Fast Low-Temp Cure Adhesive and
nnnnDow Comincf EA-6054 Thixotropic Fast Low-Temp Cure Adhesive
nnnnBe fast. Be cool.
nnnnCut Costs.
nnnnNew low-temp, fast-cure adhesives offer throughputs
nnnnup to three times faster than the industry standard.
nnnnSpeed up your processes or turn down the heat with a new generation of low-
nnnntemperature, fast-cure silicone adhesives from Dow Corning. Reduce cycle times,
nnnnenergy consumption, and even floor space, while producing a better performing
nnnnseal. This breakthrough adhesive technology from Dow Corning offers you
nnnnoptions for fast process savings.
nnnnFaster cure time for faster throughput
nnnnFast curing shortens cycle times, enabling the production of more modules in
nnnnthe same amount of time. Accelerated curing also allows use of ovens that are
nnnnshorter and require fewer fixtures than standard ovens, reducing start-up capital
nnnncosts. Shorter ovens have a smaller footprint, freeing up floor space for other
nnnnoperations.
nnnnLower temperatures for reduced operational costs
nnnnWith lower cure temperatures than the industry standard, these products allow the
nnnnuse of low-cost plastics that cannot be used with adhesives that have higher cure
nnnntemperatures, even while keeping processing times competitive.
nnnnImproved performance for demanding applications
nnnnThese fast-cure adhesives provide more choices, enabling manufacturers more
nnnndurable solutions for safeguarding sensitive electronic components in extreme
nnnnenvironmental conditions. These silicone products retain their elasticity, ensuring a
nnnnreliable seal. And the adhesives rapidly adhere to industry-critical substrates such
nnnnas polyamide, PBT ceramics and aluminum.
nnnnLow voiding for increased reliability
nnnnBubbling caused by evaporated water in plastics and nylon during cure can cause
nnnnvoids and prevent reliable sealing. The low-voiding characteristic of these adhesives
nnnnprovides better moisture tolerance and the low-cure temperature can minimize the
nnnnevaporation or boil-off of the water from the plastic, eliminating the need to dry the
nnnnplastic components.
nnnnSolutions for every need
nnnnWhatever the need, from sealing lids and housings, attaching base plates orgasket-
nnnning applications, to connector sealing and multiple plane dispensing, this new adhe-
nnnnsive technology from Dow Corning has you covered - and it's available in flowable
nnnnand thixotropic formulations.
nnnnTo learn about your best solution, visit our website at
nnnnwww.dowcornina.com/electronics.
nnnnFeatures and
nnnnBenefits
nnnnFast Low-Temp Cure Adhesives
nnnn« 2-part, 1:1 mix ratio
nnnn« Reduced voiding
nnnn« Rapid low-temperature cure
nnnn+ UV indicator for automated
nnnninspection
nnnn« Noncorrosive
nnnnDow Corning EA-6052
nnnnFast Low-Temp Cure Adhesive
nnnn« Flowable to allow channel
nnnnfilling
nnnnDow Corning EA-6054
nnnnThixotropic Fast Low-Temp
nnnnCure Adhesive
nnnn4 Non-slump, thixotropic
nnnnformulation enables
nnnndispensing on multiple
nnnnplanes
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