Sealing Electronic Components0 pages

Connectors:
Reliable
pin sealing

Relays: Pin casting –
the adhesive ows
into the cavity

Microswitches:
Pin sealing, bonding
of housing, sealing
of switch button

components within just seconds
adhesives are excellent for this purpose: Fast curing
within seconds by exposure to light (“curing on demand”)
enables immediate in-line quality control. This is how
component defects can be detected promptly and
necessary remedial actions can be taken, saving time
and cost.

DELO’s light-curing adhesives enable the reliable sealing
of microswitches, relays and connectors, xing of
electronic components, and bonding of housing parts.
Applications in the automotive industry in particular
require fast bonding processes combining short cycle
time with reliable process control. DELO’s light-curing

1C
acrylates

DELO-PHOTOBOND | DELO-DUALBOND
Fast light xation within seconds (immediate
nal strength)

Highly exible and tension-equalizing
Curing in shadowed areas (by heat or humidity)
DELO-PHOTOBOND

DELO-DUALBOND

GE4009
Viscosity [mPas]
Curing

GE4906

GE4707

1,600

2,200

1,500

UV-VIS

UV-VIS / humidity

UV-VIS / heat

9

7

7

500

500

460

Minimum curing time [s]
Elongation at tear [%]
Temperature resistance

– 40 to +150 °C

1C
epoxies

DELO-KATIOBOND | DELO-DUALBOND
Fast light xation within seconds
Can be preactivated 1) (for opaque components)

Curing in shadowed areas (by heat)
Hard or exible composite
DELO-KATIOBOND

DELO-DUALBOND

4578

KB554

AD761

GE731

12,400

1,500

11,000

17,000

UV-VIS 1)

UV-VIS 1)

UV-VIS / heat

UV-VIS / heat

Minimum irradiation time [s]

15

24

10

6

Elongation at tear [%]

3

45

84

98

Viscosity [mPas]
Curing

Temperature resistance

– 40 to +150 °C
AD = ADhesive

GE = General Encapsulant

– 40 to +180 °C
KB = KatioBond