NDT Bond Detector0 pages

BOND DETECTOR DAMI-C09
provides the impedance, eddy current and
impact testing techniques. The device is
intended to detect and C-image the defects
in composite materials and honeycomb
structures. It can also detect the corrosion,
surface and subsurface defects in different
metal constructions and alloys.
Main applications:
„h Aircraft industry
„h Space industry
„h Shipbuilding industry
„h Automotive industry, etc.
Testing materials and constructions
„h Non-metallic layer constructions (from carbon fiber-reinforced plastics, glass-reinforced
plastics, composite epoxy materials)
„h Non-metallic sheathed and polyamide paper based or other materials
„h Metal-sheathed honeycomb structures (including the perforated ones)
„h Different constructions
„h Bonded layer constructions (2-layer, 3-layer, 4-layer constructions)
„h Rough honeycomb and other structures with the altering surface impedance and (or)
alternate thickness
„h Non-ferromagnetic sheet constructions
The excellent functional capabilities of the device enable to automate the defect detection
process due to the automatic adjustment of the probe for the testing object with regard to
material density and structure. Contact liquid is not required as the dry point contact is used.