Aavid Clip Attach E Series for BGAs0 pages

Aavid Clip Attach E Series
Aavid Clip Attach E-Series for BGAs

AAVID CLIP ATTACH E-SERIES
Introducing Aavid’s line of clip attach heat sinks t
for BGA applications. The series utilizes an easy to t
mount plastic frame along with flexible wire springs. t
The wire springs are resistant to breakage and allow t
for easy installation. They provide pressure to improve t
thermal contact.

FEATURES & BENEFITS
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2.5mm keep out zone for high density PCB layout
Force applied by flexible wire spring
No short-circuit concern from UL94V-0 rated PA66
Easy mounting
Re-workable
Shock & Vibration tested
Cost Effective

ORDERING INFORMATION

Keep Out Zones

Customization is possible with different interface t
materials, finishes, and expanded heat sink size for t

2.5mm
keep out zone

smaller Rca. The standard finish is black anodize.

PCB

Part Number Specification

Substrate

EA - XXX - HXXX - XXXX
Example Part:

Die

EA 450 H175 T710

2.5mm
keep out zone

E-series t
Assembled
2.5 mm
Keep out zone

BGA Size t
(45mm x 45mm)
Heat Sink Height
(17.5mm)

Minimum 0.3mm clearance,
a
above PCB board, fter soldered

TIM Spec t
(T710)

PCB

Clip attach mounting tool part number: EA-MT001
t

USA: +1-603-528-3400t

Solder Ball

2.5mm
keep out zone

Die

BGA Height

Substrate

NOTE: Specifications are subject to change without notice

EUROPE: +39 051 764011t

ASIA: +86-21-6115-2000t

www.aavid.com