ECS-7000 series0 pages
Specification
System
Processor
Chipset
BIOS
SIO
Memory
Unit: mm (inch)
3rd Generation Intel® Quad Core™ i7 | i5 | i3 Ivy Bridge Processors (6M Cache, up to 3.30 GHz)
Intel® Mobile QM77
AMI
IT8783F
DDR3 1066 | 1333 | 1600 MHz, DDR3L 1066 | 1333 MHz
16GB Max., 2 204-pin SO-DIMM Sockets
I/O Port
Serial Interface
USB
Isolated DIO
LED
GPIO
260 (10.2”)
3 COM RS-232, 1 COM RS-232 | 485 | 422
4 USB 3.0, 2 USB 2.0, 2 Internal USB 2.0
8 DI, 8 DO (Optional)
Power, SDD and CFast LEDs
16 GPIO
Expansion
High Performance, Rugged, Extended Temp., Fan-less Embedded System with 9 GbE and
Intel® QM77 Express Chipset & Choice of 3rd Gen. Intel® Quad CoreTM i7/i5/i3 Mobile Processor
175
(6.9”)
1 miniPCIe Socket: PCIe + USB + SIM Card Socket
1 miniPCIe Socket: PCIe + USB
2 SUMIT Slots (Optional)
1 Internal 6-pin (Internal USB 2.0)
Mini PCIe
SUMIT A, B
JST Connector
Graphics
Chipset
Display Memory
Interface
260 (10.2”)
Intel® GMA HD 4000
Shared Memory, Up to 1.7GB
DB-15 VGA | 1920 x 1200 Max.
DVI-D | 1920 x 1200 Max.
Display Port 1 | 2560 x 1600 Max.
Display Port 2 | 1920 x 1200 Max.
LVDS | Dual Channel 24-bit | 1920 x 1200 Max.
Storage
SATA
79
(3.1”)
2 SATA III 6Gbps
1 SATA II 3Gbps - Support Horizontal Type SATA DOM
2 SATA II 3Gbps
CFast Slot Push In | Out Ejector
mSATA
Storage Expansion
Audio
Audio Codec
Audio Interface
Realtek ALC892, 5.1 Channel HD Audio
Line-In, Line-Out, Mic-In, Front Audio Header
Ethernet
LAN1
LAN2~6
Intel® 82579LM Gigabit LAN, Wake on LAN, PXE Support
Intel® 82574L Gigabit LAN by Each, Wake on LAN, PXE Support
Power
Power Input
1 Mini DIN
One 3-pin Terminal Block for DC-IN V+, V-, Frame Ground
DC-IN 6 ~ 36V
AC to DC +24V / 5A 120W Max. (Optional)
On-Board LT4356 for Power Input High Voltage Surge Protection
Power Input Voltage
Power Adapter
Protection
Other
Trusted Platform Module (TPM)
Watchdog Timer
HW Monitor
Mechanical
Infineon SLB9635, LPC Interface (Optional)
Reset: 1 to 255 sec. / min. Per Step
Temperature | Voltages Auto Throttling Control When CPU Overheats
260 (10.2”)
128
(5.0”)
Environment
Operating Temperature
Storage Temperature
Humidity
Relative Humidity
Vibration
-25°C to 70°C (-13°F to 157°F)
-40°C to 85°C (-40°F to 185°F)
10% to 95% Humidity, Non-condensing
95% at 70°C
Random: 5Grms @5~500 Hz according to IEC68-2-64
Sinusoidal: 5Grms @5~500 Hz according to IEC68-2-64
Operating, 50 Grms, Half-sine 11 ms Duration (w / SSD, According to IEC60068-2-27)
CE, FCC, RoHS
Shock
EMC
175
(6.9”)
94
(3.7”)
Aluminum Housing
260mm x 175mm x 79mm (10.2” x 6.9” x 3.1”)
2.8Kg (6 lb)
Wall-Mount by Mounting Bracket
Chassis Construction
Size(W x D x H)
Weight
Mounting
85 (3.3”)
3rd Gen Intel® Quad Core™ i7 | i5 | i3 Ivy Bridge
Part Number
Description
9 GbE LAN Fanless Embedded Controller, 2 SSD | HDD, Isolated DIO, iAMT 8.0
9 GbE LAN Fanless Embedded Controller, 2 Front Panel Access Removable SSD | HDD with Key Lock, iAMT 8.0
6 GbE LAN Fanless Embedded Controller, 2 SSD | HDD, Isolated DIO, SUMIT (A, B), iAMT 8.0
6 GbE LAN Fanless Embedded Controller, 2 SSD | HDD, Isolated DIO, iAMT 8.0
6 GbE LAN Fanless Embedded Controller, 2 Front Panel Access Removable SSD | HDD with Key Lock, iAMT 8.0
6 GbE LAN Fanless Embedded Controller, 2 SSD | HDD, iAMT 8.0
2 GbE LAN Fanless Embedded Controller, 2 SSD | HDD, and 4-CH, 120 fps, Built-in Video Capture Function
2 GbE LAN Fanless Embedded Controller, 2 Front Panel Access Removable SSD | HDD with Key Lock
2 GbE LAN Fanless Embedded Controller, 2 SSD | HDD
Ivy Bridge 3rd Gen Intel® Mobile Quad-Core™ i7 Processor
Ivy Bridge 3rd Gen Intel® Mobile Core™ i5 Processor
Ivy Bridge 3rd Gen Intel® Mobile Core™ i3 Processor
Vecow DDR3 4GB 1333|1066MHz RAM, Micron® Chip, Wide Temperature -40°C ~ +85°C
Kingston® DDR3 8GB PC1333 RAM
Kingston® DDR3 4GB PC1333 RAM
120W, 24V, 90VAC to 264VAC power adapter
20-in SCSI Cable, 1M
Terminal Board with One 20-pin SCSI Connector and DIN-Rail Mounting
Intel® MiniPCIe WiFi Module with Antenna
Copyright © 2013 Vecow Co., Ltd. All rights reserved.
3 Independent Displays
Support 2 SO-DIMM DDR3 or DDR3L, up to 16GB
Intel® AMT 8.0 Support
Isolated 8 DI | 8 DO, GPIO 8 DI | 8 DO
Onboard Trusted Platform Module (Optional)
2 SATA III (6Gbps) 2.5” SSD | HDD, mSATA
Description
i7-3610QE
i5-3610ME
i3-3120ME
M340S-W28M1
KVR13S9S8/8
KVR13S9S8/4
PWA-120WM4P
SCSI-20P-100
TMB-SCSI-20P
WiFi Module
5 Display Support: 2 DP, DVI-D, VGA, LVDS
QM77 System Chipset
Order Information
Part Number
2 Mini-PCIe (1 with SIM Card Socket)
9 GbE LANs, Independent LAN Controllers
79
(3.1”)
Rich I/O: 4 COM, 4 USB 3.0, 2 USB2.0,
Fanless, -25°C to 70°C Operation Temperature
175 (6.9”)
Built-In Input 80 VDC Overvoltage Protection
Mobile Processor (6M Cache, up to 3.30 GHz)
*All product specifications are subject to change without prior notice.
ECS-7000-9GD
ECS-7000-9R
ECS-7000-6GDE
ECS-7000-6GD
ECS-7000-6R
ECS-7000-6G
ECS-7000-2V
ECS-7000-2R
ECS-7000-2G
ECS-7000 series
Vecow Co., Ltd. Tel 886 2 2268 5658 | Fax 886 2 2268 1658 | www.vecow.com | info@vecow.com
ECS-7000 series support 3rd Gen Intel® Quad-Core™ series processor (6M Cache, up to 3.30 GHz), DDR3L and DDR3 maximum dual channel
16GB ram, 3 independent display (DP, DVI-D, and VGA), isolated DIO, maximum 9 GbE LANs, CFast, two 2.5” SATA 6Gp/s SSD | HDD trays, 4
COM, 4 USB 3.0 ports, JST connector, and 2 miniPCI-express, plus with overvoltage protection and Trusted Platform Module which making
ECS-7000 series stand out from others in machine vision and GigE imaging, intelligent automation, surveillance and security, and most of
embedded applications. ECS-7000 full series powered by cutting-edge the 3rd Gen Intel® Quad-Core™ i7 Processor (6M Cache, up to 3.3 GHz) not
only increasing power efficiency as much as 25% also integrates Intel® HD 4000 graphics and extremely low thermal design power as 35W
providing an enhanced reliability, safety and shock resistance for fanless operation required environments. Maximum 9 GbE LANs, ECS-7000
series provide stable and speedy Ethernet with 9.6 kb/s to 1 Gb/s data transmission option for high bandwidth and supports Ethernet Control
Automation Technology (EtherCAT).
3x
3.0
+70 C
-25 C
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