DIVISIO Series – Evolution in Depaneling

DIVISIO Compact

Compact Depaneling System

DIVISIO 3000 Compact

Description
The depaneling process of the DIVISIO 3000 Compact is
operated only in Y-direction .The DIVISIO 3000 Compact can
be equipped with differing cutting modules. It should be noted
here, that the PCB panel is processed in both cases from
above:
1. Routing spindle
2. Sawing spindle
The sawing or routing spindle is mounted onto a Y- linear-axis
system which cuts the panel in the Y-direction. The stopper
will allows automatic processing of different sized PCBs. The
PCB is transported through the machine on multi-segment
conveyors.
Description
The DIVISIO 3100 Compact is equipped with an additional
X-axis. Therefore the cutting process is carried out in X- and
Y-direction. The transport is the same like the DIVISIO 3000.
All camera functions are integrable.
The advantages of this concept are:
- t The cutting path (for routing and sawing) is not intertt
rupted by the conveyor belts i.e. the cutting path goes tt
between the conveyor segments
- t The separated PCB‘s are handed over on the same lane

Features
_ Linear drive for the Y-axis
_ Servo driven Z-axis
_ Ionization unit
_ Pneumatic stopper

DIVISIO3000Compact_111108_DS_CC_E

Options 3000
_ Camera system for automatic cut inspection
_ Quick exchange head (Routing / Sawing)
_ Pass / Fail interface
_ Traceability function
_ Sawing disc break monitoring
Options 3100
_ Camera system for :
_ Fiducial recognition
_ Teach function
_ Camera correction
_ Fail-mark recognition
_ Code read
_ Programable stopper