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EZCool0 pages
EZCool
A reliable thermal solution of processor is always highly appreciated for most applications.
The reliable solution is not only about whether the processor over its thermal specification
or keep its temperature under protection point but also noise and weight related. EZCool
is the reliable thermal solution for Intel® CoreTM 2 Duo processor, Pentium® 4 651 and
Celeron® D 352 and so on that Thermal Design Power (TDP) does not over 65W because
of it's compact size, silent cooling fan and fixing mechanism.
SPECIFICATION
Socket Type
Socket LGA 775 (CoreTM 2 Duo, Celeron® 440)
Heat Sink Dimension
90 x 90 x 18mm (L x W x H)
Fan Dimension
55.5x11.3 mm (compatible with 80mm fan)
Heat Sink Material
Fan Speed
Ball Bearing
Voltage Rating
12 VDC
Input Current
0.3 A Max. (At 25oC, in free air rated voltage)
Noise Level
39.3 dBA
Connector
3 pin
Heat Sink Weight
136.4 g (included fasteners)
Fan Weight
13.6 g
Thermal Interface
Material
EZCool
High effidency and low profile cooler for CoreTM
2 Duo processor
40,000 hours at 45oC
Bearing Type
B9970620
9.11 mmH2O (At zero static pressure and 25oC, rated speed)
Fan Life Expectancy
Model Name & Description
5.76 CFM (At zero static pressure and 25oC, rated speed)
Fan Air Pressure
Part #
4,500
Fan Airflow
ORDERING GUIDE
Aluminum extrusion base and fins
SC102
10% R.P.M.
FEATURES
Along with Intel®'s CoreTM Mircoarchitecture and advanced manufacturing technologies, processor Thermal Design Power (TDP) was
lower from 85~130W to 65W only, and even lower for single core processor in Q3 this year. As a result, Portwell is able to design a
reliable cooler that can fits most applications demanding.
Compact Size
Bending Prevention
EZCool is just one of third height of boxed cooler that benefits applications that
need low profile cooler.
Larger preload of cooler cause the main board bending and it could
introduce permanent damage to the PCB (Print Circuit Board) and traces
on it. With back plate conjunction, EZCooler makes no defection of board.
61mm
20.24mm
Twist Avoidance
Semi-symmetric Design
Main board fixed vertically in chassis instead of horizontally such as PICMG 1.x
SBC/SHB can be twisted because of the weight of cooler. It damages SBC/SHB
badly once the platform vibrates or shocks in the same direction.
The semi-symmetric heat sink design only allows air flow thru dual
directions that can help ventilation of other key components nearby and
fully leverage system air flow that draw from outside of the chassis.
140g
415g
Portwell, Inc. Headquarters
American Portwell Portwell Japan, Inc.
Beijing Portwell
Portwell (UK) Ltd.
Portwell-Laxsons India
3F, No. 92, Sec. 1, Nei-Hu Rd.,
114 Taipei, Taiwan
Tel: +886-2-27992020
Fax: +886-2-27991010
E-mail: info@portwell.com.tw
http: //www.portwell.com.tw
44200 Christy St.
Fremont, CA 94538, USA
Tel: +1-510-403-3399
Fax: +1-510-403-3184
E-mail: info@portwell.com
http: //www.portwell.com
6F, Building 3, Qunying Zone,
Chuangye Rd. 8, Shangdi,Haidian
District, Beijing, China 100085
Tel: +86-10-82701616
Fax: +86-10-82700606
E-mail: info@portwell.com.cn
http: //www.portwell.com.cn
Unit 7, Holloways, Bessemer Close
Ebblake Industrial Estate, Verwood,
Dorset, BH31 6AZ, UK
Tel: +44(0)1202-813816
Fax: +44(0)1202-813817
E-mail: info@portwell.co.uk
http: //www.portwell.co.uk
Laxsons House, AA2, Walbhat Road,
Goregaon (E), Mumbai - 400 063,
Maharashtra, India
Tel: +91-22-2685-9911
Fax: +91-22-2685-9922
E-mail: info@portwelllaxsons.com
http://www.portwelllaxsons.com
101-0042 ShowaKanda Build, 10-2
Kanda Higashi matsushita-cho
chiyoda-ku Tokyo Japan
Tel: +81-3-5298-8071
Fax: +81-3-5298-8072
E-mail: info@portwell.co.jp
http: //www.portwell.co.jp
M070209
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