PCB FABRICATION Embedded Passives – Buried Capacitance ®0 pages

PCB FABRICATION

Embedded Passives – Buried Capacitance®

Improve signal integrity.
Sanmina-SCI’s Buried Capacitance technology can increase the
performance of printed circuit boards.

With the continuous trend to smaller feature sizes
and faster signal speeds, embedded passives are
becoming more cost-effective solutions for improved
signal integrity. The Sanmina-SCI® Buried Capacitance®
technology provides an effective approach for
decoupling high-performance printed circuit board
(PCB) components while reducing electromagnetic
interference (EMI). Key performance enhancements
in the Buried Capacitance laminate include thickness
tolerance, improved dimensional consistency, and
reduced levels of electrical breakdown during testing
and use.
Buried Capacitance technology allows for a very thin
dielectric layer that provides distributive decoupling
capacitance and takes the place of conventional
discrete capacitors. Unlike standard laminates, special
copper foils and foil orientation are required to ensure
uniform capacitance and electrical integrity.
Leading-edge Technology
To support an expanding market for Buried Capacitance
products, Sanmina-SCI has globally licensed the ZBC2000® and ZBC-1000™ technologies to more than
20 PCB fabricators and material manufacturers. The
ZBC-2000 laminate is constructed using a single ply of
either 106- or 6060-style prepreg, yielding a dielectric
thickness after lamination of .0020 ± .0002 inches
when measured by cross sectioning. The ZBC-1000
technology results in a .0010-inch dielectric distributed
capacitance material. FaradFlex™ and Interra™ Buried
Capacitance products utilize a durable resin system
for non-reinforced dielectrics for 1 mil thickness and
below. Even more, higher capacitance value dielectrics
have been developed using patented barium titanate
technology.
As one of the world’s largest manufacturers of hightechnology PCBs, Sanmina-SCI has significant experience designing and manufacturing boards using
Backdrilling and Blind-Via Formation technologies. We
offer these technologies in each of our fabrication sites
worldwide and provide design for manufacturability
(DFM) support for our customers in pre-design and
layout phases to ensure the smooth integration of
these technologies to the production process.

Product Highlights:
• Improved EMI
• Improved reliability
• Improved manufacturability due to t
glass reinforcement and specialty t
resins for film-based versions
• Improved power distribution
• Reduction of high-frequency
discrete by pass capacitorstt
material through common standard

• Reduction of undesired discrete t t
t capacitor resonance
t • Lower-plane inductance at high tt
t t frequencies
• Worldwide network of licensed tt
t laminators and fabricators
• Guaranteed quality and
t consistency of material through tt
t common standard

Buried Capacitance® – laminates impedances

Buried Capacitance® – cross section