Microfor SACE0 pages

Spark Assisted Chemical Engraving

Posalux is a leader in industrialization of micro technologies
for mass production.
Spark Assisted Chemical Engraving is an innovative solution to
machine glass substrates without material alteration, keeping
transparency properties with high accuracy.

Achievable machining features

Micro Machining
• Hole diameter from 80 µm (0.0032 inch)
• On any glass materials (Borosilicale, Pyrex, ...)
• Glass transparency property not impacted
• Without material deposit and no damages or burrs
• Wall thickness / hole diameter ratio up to 10

tttt Machined micro-hole

• Smooth and clear machined surfaces

Diameter’s tolerance: 5 - 10%

• No clean room facilities needed

Application field
• Electrical circuits: TGV (Through Glass Via)
• Photonics: optical waveguides and interconnects
• Watch industry

• Micro fluidics : grooves, large wall thickness holes

Texturing examples

on micro-hole and micro-channel

• Production of LCD display
• MEMS devices

Chemical engraving
• Material removal thanks to thermo-chemical process
• Physical attack by discharges
• Chemical etching (breaking Si-O-Si bonds by OH radicals)
• High removal rate obtained thanks to micro-force closed-loop regulation
• Process stability by electrolyte circulation and temperature control

Machining specifications
• Drilling speed: 100 µm/s up to 200 µm/s, then 50-60 µm/s
• Groove machining speed: 20-100 µm/s (depth from 100 µm to 1000 µm)
• Tolerances on channel width: 5%

Spark Assisted Chemical Engraving

1 mm