عضویت 
ورود اعضا
راهنمای خرید
FINEPLACER® matrix ma0 pages
FINEPLACER® matrix ma
Semi- automatic Die Bonder
FINEPLACER® matrix ma
The FINEPLACER® matrix ma is a semi- automatic
bonder providing a stable, high accuracy solution for a
broad range of component and substrate sizes, and a
bonding area up to 300mm.
Highlights*
Placement accuracy 3 µm
Components from 0.1 mm x 0.1 mm
to 150 mm x 150 mm
Substrate sizes up to 350 mm x 350 mm
Supports wafer sizes up to 300 mm
Closed loop force control
Real time contrast optimization with LED lighting
Low maintenance, easy service access as a
design priority
Fast conversion from die bonder to rework station
Incorporating an ergonomic approach to bonder
design, this state- of- the- art platform, combines
application modularity within an open hardware and
software environment.
Supporting a virtually unlimited field of applications
including flip chip bonding, photonics and wafer level
packaging, this system uses numerous die
bonding technologies which ensures compatibility with
future technologies as users transition from R&D into
production.
* depending on configuration and application
Finetech GmbH & Co. KG | Wolfener Str. 32/34, Haus L | 12681 Berlin, Germany | Phone: +49 (30) 936681-0 | Fax: +49 (30) 936681-144 | Web: www.finetech.de
* depending on configuration/ application, (1) standard value, other values on request, (2) optional modules
Technical information are subject to change without prior notice.
printed: 16.10.2014
"
