KMC0 pages

KM Series
MARCH 2008 37
Technical Characteristics
High Density PCB Connectors
ESA/ESCC 3401/039
NF C-UTE C 93-424
· Equipped with 0.50mm contacts
· High density interconnection
· Up to 162 signal contacts / 3 rows
· 1.905mm between rows
· 1.27 mm between contacts quincuncial
· Low contact insertion
· Low contact resistance
· Polarization by guiding or locking devices
· 5000 mating and unmating cycles
MATERIALS
Moulding Glass fiber filled diallyl - phtalate
Contacts Brass or bronze
Guides - coding styles - screws Stainless steel or nickel plated brass or ARCAP
PLATING Standard ESA
Pin 0.25ìm Gold/1.27ìm Ni 1.27ìm Gold/1.27ìm Ni (min)
Socket body
0.25ìm Gold/1.27ìm Ni on activ area
0.25ìm Gold/1.27ìm Ni (min)
1.27ìm Ni on non activ area
Socket wires 1ìm Gold/0.20ìm Ni 1.27ìm Gold/0.20ìm Ni (min)
Guides (brass) Ni Ni
DIELECTRIC WITHSTANDING VOLTAGE 800Vrms
CURRENT RATING (at 25 °C) 3A Max (25°C)
INSULATION RESISTANCE > 104MÙ (500Vcc)
CONTACT RESISTANCE 8mÙ
TEMPERATURE RANGE -55°C, +125°C
CONTACTS HYPERTAC® type Ø 0.50mm
PITCH
1.905mm between rows
1.27mm between quicuncial contacts
GUIDING
By two outside guides (2 guiding styles)
and one central guide (3 guiding styles)
KEYING
By rotating of outside polarised guides
(Up to16 keyings)
MASS & POWER CONTACTS
HYPERTAC® type can be used instead
of outside guides